Ultra-micro hole machining technology is used in a broad range of key product devices, including semiconductors, laboratory instruments, and optical communications devices. We offer a large variety of machining technologies to provide the best solutions to customer requests, including electrical discharge machining (good for materials difficult to cut with a drill or press), nano-order hole machining via FIB processing, and laser processing for high-speed machining.
Our technology, perfected through designing and producing spinning nozzles for synthetic fibers, provides high-quality machining at a high aspect ratio (L/D).
Suited to machining materials difficult to machine with a drill or press.
Machining technology developed in-house.
Suited for micro-holes and mass production.
Laser machining technology that realizes high precision (narrow-pitch), high-speed processing. Machining technology developed in-house.