Masks for Detectors

Masks for Detectors
  • Masks for Detectors
  • Masks for Detectors
  • Masks for Detectors
  • Masks for Detectors
  • Masks for Detectors

For detectors which use radiation (e.g. X-rays, gamma rays) or visible light to provide high-performance shielding to the specified detection areas.

What are the masks?

What are the masks?

The detectors which use radiation including X-rays/gamma rays/electron beam, or visible light, are widely utilized in various fields for R&D purposes or in actual devices. In the detection process in those devices, “noise” may occur which could interrupt proper detection and imaging. To remove the noise, the radiation or the light needs to be shielded for specified detection areas by the masks.

There are two keys that determine the performance of the masks. One is to select the right material suitable for the type of radiation/visible light. The other is the mask shape to successfully determine where to shield.

Toray Precision puts your desired masks into shapes for those detectors, with its proven technologies of high-precision processing.

Contact us today for any questions, inquiries, or trial piece requests.

Our Strength

  • High-precision processing.
    Minimum hole size : Φ0.5µm  Minimum pillar width : 0.1µm
  • Precise processing of corner radii, maintaining sharp corner edges (compared to etching).
  • Narrow-pitch processing.
  • Processing of difficult-to-cut and high-melting-point materials including tungsten, molybdenum, and tantalum.
  • Beam processing to draw patterns. Less processes (compared to etching), easier-to-do.
  • Various sizes and patterns can be flexibly processed.
  • If you desire to have mesh patterns on thin films, we can make holders for you to handle the delicate films after delivery.
  • In addition to metals, semiconductor materials including Si or SiC are supported.

Specifications or accuracy we can achieve may change depending on the thickness of the materials. Contact us for details.

Specifications

Hole Processing
Minimum size Φ0.5µm
Depends on thickness of material
Minimum width of pillar 0.1μm-
Depends on thickness of material
Aspect Ratio Up to fivefold
Surface Roughness Ra0.1µm or less is achievable
Material
Thickness Maximum 50μm
Material Tungsten, Platinum, Gold, Tantalum, Molybdenum, Si, SiC, and more.

Examples

●Special mask
【Specifications】
Thickness:50μm
Slit width:20μm
Material:Molybdenum

【Method】
Beam processing

●Coded mask
【Specifications】
Minimum side length of a square hole:1.2mm
Thickness : 1.0mm
Material:Tungsten
Bridges are no longer required as resin supports are applied.

【Method】
Metal 3D Printing
Click here for details

●Square hole mask
【Specifications】
Hole size: 50μm square
Thickness : 5µm
Material:Gold
Pillar width : 20μm

【Method】
Beam processing

●Circle hole mask
【Specifications】
Hole size:Φ0.50μm
Material:Silicon nitride
Thickness : 0.2mm

【Method】
Beam processing

●Narrow pitch mask
【Specifications】
Hole size:Φ100μm
Pitch:110μm
Material:Stainless steel
Aperture ratio : 75%

【Method】
Beam processing

●Circle hole mask
【Specifications】
Hole size:Φ0.50μm
Pillar width:0.1μm
Material:Platinum foil
Thickness : 1µm

【Method】
Beam processing

Please consult in such a case